Chiplets - advanced packaging - have emerged within a decade, creating a new turning point in the semiconductor technology development roadmap. As a country that has only modestly participated in the packaging stage, does Vietnam have the potential to "turn the tables" and step deeper into a complex and know-how-intensive value chain of the semiconductor industry?

Over the past 10 years, the emergence of chiplets, advanced packaging, has opened a new trend in the design and production of microchips. Chiplets allow the packaging of many discrete transistors into a compact block, saving costs, optimizing performance and creating opportunities for end customers to freely customize and decide what the next generation of chips will be.

In the chip manufacturing market today, the focus is no longer on which foundry is producing chips at the smallest process node and at what size, but has shifted to: who is ordering chip packages with dozens of chiplets inside for a specific application and which foundry is capable of meeting this demand, or even some applications that no longer care about power factors but require packaging semiconductors together to combine as many features as possible in a single “package”.

Will this way of arranging existing semiconductors together with an architectural diagram similar to finding and assembling LEGO pieces like that open up a new playing field for everyone or will it still be reserved for a few big players like today? And is advanced packaging a real opportunity for latecomers like Vietnam to join the semiconductor industry value chain? If not, how can Vietnam join the semiconductor manufacturing sector?

The seminar "Chiplet and opportunities to participate in the semiconductor value chain" organized by Tia Sang and the Vietnam Microchip Community will contribute to answering the above questions, with the participation of the following speakers:

Dr. Nguyen Bich Yen - Senior Researcher, Soitec Company (USA)

Dr. Trinh Hai Dang - Technical Manager, TSMC Company (Taiwan)

Dr. Nguyen Thanh Tien - Chief Engineer, Display Manufacturing Research Center (Korea)

Engineer Huynh Tran Hai Au - Synopsys Company (USA)

MSc. Duong Minh Tien - Transistor Grid Development Engineer (Korea)

MSc. Nguyen Thanh Yen - Administrator of the Vietnam Microchip Community -.

Time: 8:30 AM, Saturday, October 5, 2024 (Vietnam Time)

Form: Online via Zoom

Registration link: or

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Tia Sáng